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| PROBE STATIONS |
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 Copper Diffusion Test Systems
The CSM/Win suite of semiconductor test systems and software has been completed by software and hardware for copper
diffusion studies.
This feature plays an important part in the development
of processes and materials in integrated
circuit technology that employs copper as a conductor.
Special Current-Voltage Bias-Temperature Stress (IV-BTS) software
can measure the degradation of insulator quality due to copper
diffusion.
Multiple test sites can be stressed with a constant voltage while
the current through each site is measured and recorded.
The Current-Voltage Bias-Temperature Stress test supplements conventional
MOS C-V measurements and Triangular Voltage Measurements (TVS)
that are also employed in copper diffusion studies.
–› Download
CU diffusion test system datasheet .pdf
MDC Sealed
test chambers:
Also available from
MDC are sealed test chambers that facilitate testing in an inert
atmosphere where the copper will not oxidize. Two test chambers
configurations are available to use with the MDC QuietCHUCK Hot
Chuck System.
• Model DG-8 Glove Box
Designed for copper diffusion studies,
the Model DG-8 enclosure surrounds the probe station with an airtight
glove box. Includes an airlock for transfer of samples, a hot
chuck for temperature stress, video microscope stand, inert gas
connectors, and a feedthrough panel for multiplexer and instrument
connections.
• Model D3-STC Hermectic Enclosure
The Model D3-STC is a hermetically
sealed dark box that is a little larger than our standard 10-probe
enclosure. Includes a hot chuck for temperature stress, inert
gas connectors, and feedthroughs for multiplexer and instrument
connections.
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More info on Probe stations on MDC USA website |
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