Advanced Spectral Defect Detection and Metrology.
Applications:
– Wafer level defect detection & measurement
– Process development or production
– Precision MEMS and HD component inspection
– Advanced microelectronics package inspection
Features:
– manual / automatic operation
– up to 100 defects/measurements per second
– 200mm/second part staging speed
– up to 300mm wafers
– vision based parts alignment
– high accuracy stage 0.02 um linear encoder resolution
– high resolution CCD array with software controlled backlighting
– Win 7 with RMS vision systems metrology software
– custom operator interface, data formats, reports
– power requirements: 230Vac, 15A
Benefits:
– fast measurements
– dual production / engineering use
– extensive defect detection and classification
– integrated precision dimensional metrology
– color graphics and CAD drawing import / export
– customized software, optics and handling options
