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- Manufacture of customized silicon wafers with additional layer
- Service by adding layer on wafers already purchased by customers
- Option: possibility to provide the oxide thickness for each wafer (Only made after laser identification)
Customers
- MEMS, nano wired, nanotube, graphene, exotic material growth, biochemistry
Core Competences
- SiO2: High quality, internally made
- Dry oxidation up to 300 nm from 1’’ to 5’’ (cf fig 1, fig 2)
- Si3N4 > 150 nm
- Other kind of metallic layer: Pt, Au, Ag, Poly, Si, Ti TiO2 (Non-exhaustive list )
- Roughness < 3 Å (AFM measurement)
- High quality for graphene deposit thanks to the dry oxide quality
