SILICON WAFERS

  • Standard wafers
  • Misoriented wafers
  • Heavily doped wafers
  • Customized diameter wafers
  • Wafers with additional layer

Core Competences

  • Production of small and medium volumes
  • Production of customized products
  • Quality products
  • Any kind of flat
  • Any position for the flats
  • Any position for the flats
  • Any quantities of flats

Standard Wafers

Technical offer

  • Manufacture of customized silicon wafers
  • From 1’’ to 6’’, any size from 10mm to 150mm
  • Thickness up to 5 mm
  • Any orientation
  • Any positions and quantities for the flats
  • Resistivity :
    Cz Intrinsinc > 200 Ohms.cm (Beyond this value, no possibility to measure. Fz are used)
    Highly doped :
    P Bore: 0,7 mOhm.cm min.
    N Bore: 1 mOhm.cm min.

Customers

  • MEMS, nano wired, nanotube, graphene, exotic material growth, biochemistry

Core Competences

  • MEMS, nano wired, nanotube, graphene, exotic material growth, biochemistry
  • Low and medium volumes totally customized
  • Orientation accuracy (Up to 0.05°) on the side and the main flat (frank flat accuracy up to 0.05°)
  • TTV Double side: 4’’ > 400µm => TTV < 2µm
    6’’ > 500 µm => TTV < 3 µm
  • TTV measurement: possible to deliver the value for each unit if the wafer is identified by laser
    marking

Misoriented Wafers

Technical offer

  • Manufacture of customized silicon wafers
  • From 1’’ to 6’’, any size from 10mm to 150mm
  • Thickness up to 5 mm
  • Any position for the flat
  • Resistivity:
    -Cz Intrinsinc 200 Ohms.cm (Beyond this value, no possibility to measure, Fz are used)
    -Highly doped :
    P Bore: 0,8 mOhm.cm
    N Bore: 1 mOhm.cm
  • Misorientation from 0.20° at 14° regarding the orientations (100) or (111) with an accuracy of 0.02°
  • Misorientation from 14° to 25° regarding the orientations (100) or (111) with an accuracy of 0,5°

Customers

  • MEMS, nano wired, nanotube, graphene, exotic material growth, biochemistry

Core Competences

  • Misorientation accuracy
  • Orientation beyond 5°

Wafer with additional layer

Technical offer

  • Manufacture of customized silicon wafers with additional layer
  • Service by adding layer on wafers already purchased by customers
  • Option: possibility to provide the oxide thickness for each wafer (Only made after laser
    identification)

Customers

  • MEMS, nano wired, nanotube, graphene, exotic material growth, biochemistry

Core Competences

  • SiO2: High quality, internally made
    • Dry oxidation up to 300 nm from 1’’ to 5’’ (cf fig 1, fig 2)
  • Si3N4 > 150 nm
  • Other kind of metallic layer: Pt, Au, Ag, Poly, Si, Ti TiO2 (Non-exhaustive list )
  • Roughness < 3 Å (AFM measurement)
  • High quality for graphene deposit thanks to the dry oxide quality

PARTICULAR WAFERS

  • Thin wafers

Core Competences

  • Production of small and medium volumes
  • Production of customized products
  • Quality products
  • Any kind of flat
  • Any positions for the flat
  • Any quantities of flats

Thin Wafers

Technical offer

  • Manufacturing of thin silicon wafers from 4’’ to 6’’

Customers

  • Watch maker, MEMS

Core Competences

  • Product under development, new formats will arrive soon
  • Roughness is equal to a standard value: 5 Å RMS

Specific Products

  • Silicon crystals
  • Zero Background holders
  • X-ray crystals
  • THz sources
  • Sputtering target

Core Competences

  • Production of small and medium volumes
  • Production of customized products
  • Quality products

Silicon Crystals

Technical offer

  • Research centers for neutron sources and Infrared

Customers

  • MEMS, nano wired, nanotube, graphene, exotic material growth, biochemistry

Core Competences

  • Expert in polishing
  • Roughness less than 3 Å
  • Excellent flatness
  • Refurbishment

Zero Background Holder

Technical offer

  • Manufacture of customized Zero Background Holder (with cavity or not)
  • Thickness from 500 µm to 5000 µm
  • Precise diameter: From 10 mm to 48 mm with a precision of +/- 0,1mm
  • Standard diameters: From 25,4 to 32 mm

Customers

  • Any laboratory fitted with XRD machining

Core Competences

  • Customized manufacturing
  • No diffraction on X-rays
  • Orientation accuracy: 0,2°
  • Manufacture of different orientations: (510), (911), (100)9°(001)

X Ray Crystals

Technical offer

  • Manufacture of customized crystals
  • Totaly customized regarding the technical specification from the customer
  • The maximum size is a diameter of 15cm with a length of 20cm

Customers

  • Any laboratory, research centers working on X-rays

Core Competences

  • Customized products as per customer scheme
  • Polishing technique
  • Roughness less than 2 Å RMS
  • Finishing : chemical-mechanical polishing

THz Sources

Technical offer

  • Manufacture of ATR crystals
  • Manufacture of THz prisms

Customers

  • Radiometry, radio astronomy

Core Competences

  • Polishing on bevels
  • Polishing on edges
    • Chemical-mechanical polishing
      • Roughness < 1nm
    • Diamond polishing on edges
      • Roughness < 5nm

Sputtering target

Technical offer

  • Manufacture of customized Sputtering target:
    • Diameter : From 10 to 150 mm
    • Thickness : from 0.5 mm to 10 mm
  • Manufacture of standard Sputtering target:
    • Diameter: 60 mm
    • Thickness: 5 mm
    • Finishing: etch

Customers

  • Any laboratory fitted with XRD machining

Core Competences

  • Any shape: rectangular, annular, or oval target.
  • Any orientation

Quartz