Technical offer

• Manufacture of customized silicon wafers
• From 1’’ to 6’’, any size from 10mm to 150mm
• Thickness up to 5 mm
• Any orientation
• Any positions and quantities for the flats
• Resistivity :
  Cz Intrinsinc > 200 Ohms.cm (Beyond this value, no possibility to measure. Fz are used)
  Highly doped :
  P Bore: 0,7 mOhm.cm min.
  N Bore: 1 mOhm.cm min.

Customers

• MEMS, nano wired, nanotube, graphene, exotic material growth, biochemistry

Core Competences

• MEMS, nano wired, nanotube, graphene, exotic material growth, biochemistry
• Low and medium volumes totally customized
• Orientation accuracy (Up to 0.05°) on the side and the main flat (frank flat accuracy up to 0.05°)
• TTV Double side: 4’’ > 400µm => TTV < 2µm
  6’’ > 500 µm => TTV < 3 µm
• TTV measurement: possible to deliver the value for each unit if the wafer is identified by laser
  marking

Technical offer

• Manufacture of customized silicon wafers with additional layer
• Service by adding layer on wafers already purchased by customers
• Option: possibility to provide the oxide thickness for each wafer (Only made after laser
  identification)

Customers

• MEMS, nano wired, nanotube, graphene, exotic material growth, biochemistry

Core Competences

• SiO2: High quality, internally made
  • Dry oxidation up to 300 nm from 1’’ to 5’’ (cf fig 1, fig 2)
• Si3N4 > 150 nm
• Other kind of metallic layer: Pt, Au, Ag, Poly, Si, Ti TiO2 (Non-exhaustive list )
• Roughness < 3 Å (AFM measurement)
• High quality for graphene deposit thanks to the dry oxide quality

Technical offer

• Manufacturing of thin silicon wafers from 4’’ to 6’’

Customers

• Watch maker, MEMS

Core Competences

• Product under development, new formats will arrive soon
• Roughness is equal to a standard value: 5 Å RMS

Technical offer

• Research centers for neutron sources and Infrared

Customers

• MEMS, nano wired, nanotube, graphene, exotic material growth, biochemistry

Core Competences

• Expert in polishing
• Roughness less than 3 Å
• Excellent flatness
• Refurbishment

Technical offer

• Manufacture of customized Zero Background Holder (with cavity or not)
• Thickness from 500 µm to 5000 µm
• Precise diameter: From 10 mm to 48 mm with a precision of +/- 0,1mm
• Standard diameters: From 25,4 to 32 mm

Customers

• Any laboratory fitted with XRD machining

Core Competences

• Customized manufacturing
• No diffraction on X-rays
• Orientation accuracy: 0,2°
• Manufacture of different orientations: (510), (911), (100)9°(001)

Technical offer

• Manufacture of customized crystals
• Totaly customized regarding the technical specification from the customer
• The maximum size is a diameter of 15cm with a length of 20cm

Customers

• Any laboratory, research centers working on X-rays

Core Competences

• Customized products as per customer scheme
• Polishing technique
• Roughness less than 2 Å RMS
• Finishing : chemical-mechanical polishing

Technical offer

• Manufacture of ATR crystals
• Manufacture of THz prisms

Customers

• Radiometry, radio astronomy

Core Competences

• Polishing on bevels
• Polishing on edges
  • Chemical-mechanical polishing
    • Roughness < 1nm
  • Diamond polishing on edges
    • Roughness < 5nm
      

Technical offer

• Manufacture of customized Sputtering target:
  • Diameter : From 10 to 150 mm
  • Thickness : from 0.5 mm to 10 mm
• Manufacture of standard Sputtering target:
  • Diameter: 60 mm
  • Thickness: 5 mm
  • Finishing: etch

Customers

• Any laboratory fitted with XRD machining

Core Competences

• Any shape: rectangular, annular, or oval target.
• Any orientation