Stressless Marangoni wafer handling (NO BREAKAGE), low metal contamination and IPA consumption.
Drying technology for up to 300mm wafers
Benefits
NID Dry stands for Nitrogen IPA Dispense Dry and is a surface
tension gradient dryer
Drying technology for up to 300 mm wafers.
> Stand-alone or integrated in a wet bench
> Optimized footprint
> Proven technology
> Watermark-free
> No wafer breakage
Features & Benefits
Applications
Drying of wafers, ICs, MEMS, LED, photo masks, glas substrates
General Features
> Drying of 25 or 50-wafer batches up to 300 mm wafers
> Standard high or low profile cassettes
Specification
Process Time: typical < 10 min, depending on selected recipe
Hydrophilic wafers: ≤ 10 adders @ 0.12 µm
Hydrophobic wafers: ≤ 30 adders @ 0.12 µm
Metal contamination: ≤ 1·1010 atoms / cm2 added for any trace metal
Drying spots: non, after drying
IPA consumtion: ≤ 30 ml / run
Edge exclusion: 3 mm
Graphical User Interface
> Based on B&R plc
> Recipe editor
> Automatic generation of diagnostic files (EOR, ERR etc.)
> Multi-tiered password levels
General Installation data
Dimensions: 660 x 1440 x 2200 (L x D x H)
Nom. Voltage: 3 x 400 VAC
Rated frequency: 50 Hz
Nominal current: 3 x 33 A (etc.)
Available training
Operator, maintenance and process
Build to comply with
> CE
> Semi S2 and S8
> FM 4910
> SECS/GEM
Available options
> Minienvironment
> IPA concentration monitoring system
> N2 hot
> UPS unit
Reliability
> MTBF ≥ 800 h
> MTBA ≥ 300 h
> Uptime ≥ 97 %
